Tim Lee - Candidate for 2024 IEEE-USA President-Elect

Creating Value for Membership: Inspire IEEE members to contribute to our technical communities  and to Advance Technology for Humanity. #ConnectivityMatters
VOTE FOR TIM LEE AUG'23

Experienced Technical Leader for our Future

I am running for IEEE-USA President-Elect.

I am a Boeing Technical Fellow in Southern California with expertise in chip design and advanced packaging. This experience gives me the background to promote IEEE as the trusted partner to seek mutual benefits for all stakeholders of the US CHIPS Act programs.

My engineering degrees are from MIT and the University of Southern California.

I am serving on multiple IEEE committees. I have been a member of the IEEE Board of Directors, the IEEE Region 6 Director and past President of the Microwave Theory and Technology Society. 

By leveraging the US CHIPS Act, we can make IEEE relevant to our next generation of engineers who will be the workforce that will develop microelectronics that will benefit humanity.
I will strengthen our impact on policies related to technology, R&D, and STEM education at university and K-12 levels. IEEE will foster career opportunities for women and for underserved communities.

Our goals is to make IEEE the trusted partner for the semiconductor ecosystem.

Thanks for your vote. 

POSITION STATEMENT

Biography

Timothy Lee is a Boeing Technical Fellow in Southern California. He leads development of disruptive microelectronics technologies for advanced communications networks and sensor systems for airborne and space applications. His research interests include 3D Heterogenous Integration (3DHI) technologies (for chiplet/wafer stacking of digital/analog/RF silicon/III-V devices for high-performance) and low-power microelectronics for aerospace and defense applications. He is principal investigator for the transition of IRAD, CRAD, and university Lab to Fab research to technologies for defense. 

He has held technical and managerial positions at research facilities, aerospace companies, and semiconductor foundries. He has led development of hardware for satellite communications and has built phased-array antenna electronics for commercial and US government customers. Lee has authored >30 journal and conference papers. He holds SMEE and SBEE degrees from MIT and a master’s degree in systems engineering from the University of Southern California.

"Doing Good Brings GREAT Returns."


What we do best

IEEE is the global convener of the community of electrical and electronics engineers. What must we do to define the value proposition for us to remain essential to the global technical community and to technical professionals? 

Defining the Future

The strength of IEEE is found in the spirit/capabilities of our members who represent professionals, educators, students, high-tech companies and institutions. As a change agent, I will bring change for our future by motivating members to become volunteers, by embracing diversity and above all, empowering others to Advance Technology for Humanity.

As IEEE-USA President, I will develop membership value propositions for us to remain essential to the global technical community and to technical professionals. I will leverage my 40+ years’ experience as a technical leader in aerospace industry and my extensive IEEE experiences. 

Together, we must foster cooperation between IEEE-USA, MGA, TAB, Standards, and Humanitarian Technology to meet member expectations of joining and staying as IEEE members for life. 

Creating New Product & Services

The top challenge for IEEE-USA is the continued decline of memberships, resulting in Region realignments and financial hardships. My goal is to make IEEE relevant for next-generation of US-based students, YPs, and professionals, through relationships with microelectronics stakeholders in industry, academia, and government. IEEE-USA, working with other Operational Units, should be the trusted partner supporting the semiconductor engineering ecosystem.

The 2022 $52B US CHIPS and Science Act represents a generational opportunity for our nation to reestablish technical and economic leadership, and to strengthen economic growth, job creation, US-based supply chains, and -- most importantly -- national security. We should now establish an IEEE CHIPS Act strategy, with representation across all major OUs.

Our goals will be to:

• Achieve through innovation IEEE-USA’s mission and vision to be the voice of members, technical professionals, and the public.
• Direct IEEE-USA’s three divisions to develop CHIPS Act initiatives.
• Engage with microelectronics stakeholders in industry, academia, and government to offer opportunities for satisfying career paths in microelectronics design, fabrication, testing, and packaging in underserved communities.
• Direct MGA US Directors to develop connections with Regional hubs, and organize job fairs and YP/WIE events with local employers.

As a recognized microelectronics expert with exceptional relationships with the relevant stakeholders in industry, academia, and government, my goal is to make IEEE relevant for next-generation of US-based students, YPs and professionals.

Diversity and Inclusiveness

We must foster technological innovation and excellence to benefit humanity that requires the talents and perspectives of people with different personal, cultural, and disciplinary backgrounds. I will work to make the IEEE the home for all Technical Professionals.

We must advocate initiatives for Sections, Chapters, Student Branches, Young Professionals, Women in Engineering and Life Members to develop the next generation of IEEE leaders.
We must reach out to industry and implement engagement strategies for professionals and entrepreneurs with the IEEE-USA.

We must work across all IEEE Operational Units and with external organizations to develop cross-cutting solutions to global challenges.

Meeting our Commitments

This year, the IEEE, led by President Saifur Rahman, has brought a renewed focus on what IEEE should do to support Sustainability and the effects of Climate Change. Despite the advances in technology that we enjoy, there are many who do not even have the basic necessities of life: clean water, reliable energy, affordable housing and healthcare, access to education and meaningful access to the Internet. Through our shared commitment as the IEEE community, we will improve the quality life for underserved local communities by working together, creating technical innovations and reaching to others as we all strive to make a difference.  The Value in IEEE membership is not just to better our own lives but to first deliver solutions for a better world. 

Together, we can leverage the strength and reach of the IEEE to make a difference worldwide

Qualifications

Timothy Lee is currently a Boeing Technical Fellow at The Boeing Company and leads the development of disruptive microelectronics technologies for advanced communications networks and sensor systems for airborne and space applications. His current research interests include 3D heterogenous integration (3DHI),  silicon Application Specific Integrated Circuits (ASICs) and gallium nitride Monolithic Microwave Integrated Circuits (MMICs).  He is an IEEE Life Senior Member. Tim holds BS and MS EE degrees from Massachusetts Institute of Technology and a MS in Systems Architecture and Engineering from the University of Southern California.
  • Technical skills – Contributions in state-of-the-art microelectronics for system applications as evidenced by increased levels of responsibility within Boeing Research & Technology and Boeing Defense System Space and Security, engineering delivered to many Boeing production programs including US Air Force communication systems and commercial 787 aircraft program, enhanced customer satisfaction rating, contract awards and recognition as an Associate Boeing Technical Fellow in 2006 and Boeing Technical Fellow in 2008. 
  • Leadership skills – demonstrated through leadership roles at IEEE Board of Directors, Chapter, Section, Region and Society levels. As the IEEE Region 6 Director, I led the expansion of the IEEE MOVE program to the West Coast by bringing up the volunteer-based disaster relief communication truck to be based in San Diego.  As the 2015 MTT-S President, I led the Society’s activities to serve our membership of over 10,000 members and over 200 Chapters. MTT-S serves the technical community through the publication of multiple world-class technical journals and the organization of conferences that are organized throughout the world. Managed MTT-S Administrative Committee of 30 board members and multi-million-dollar operational budget. 
  • Organizational Skills - I led the 2020 IEEE International Microwave Symposium as General Chair and successfully pivoted the week-long event with expected attendance of 10,000 from in-person to first ever virtual conference during the COVID-19 Pandemic.
  • Collaborative and Communications skills - demonstrated as the IEEE SIGHT Chair to organize and motivate an effective team to promote humanitarian projects led by feet-on-the-ground volunteers in all IEEE Regions. 
  • Management/Business skills – demonstrated through increasing levels of industry responsibility from small ASIC design groups to satellite product groups that delivered thousands of flight-qualified modules into operational satellites flying today. Mentored many young professionals into productive engineers who have been recognized through promotions and awards.
  • Relationship skills – demonstrated through ability for team-building both within IEEE activities: evidenced by cooperation with other region directors to successful resolve the IEEE Region Realignment issue in MGA, improved operational efficiency of the MTT-S Adcom, cohesive culture of the IEEE SIGHT Committee and inspiration of IEEE Young Professionals to try new ideas in IEEE SIGHT projects, and externally by the growing relationships between IEEE 3I and Internet governance / connectivity communities (World Economic Forum, World Bank, USAID, non-profits).

ACCOMPLISHMENTS


  • • Collaboratively guided IEEE through the COVID-19 pandemic.
  • • Collective efforts led in successful MGA Region Realignment proposal.
  • • Launched Region 6 IEEE MOVE West and DEI initiatives.
  • • Co-Chaired the FDC IEEE Future Networks Technical Initiative, which transitioned to Technical Community (FNTC).
  • • Co-Chaired Roadmaps for IEEE HIR and FNTC.
  • • Led IEEE 3I, HAC, SIGHT programs for a sustainable future.
  • As an IEEE leader, I am most pleased with my impact on Young Professionals and students; mentoring them in their early stage careers and shaping their development as leaders. Three such individuals have received MGA Outstanding Young Professionals Achievement Awards for their contributions to promote young professional member engagement and development by advancing IEEE MGA goals and strategies through activities and programs at the Chapter, Society, Section, and Region levels while performing humanitarian activities. These individuals were from Regions 7 and 10. I also advised the IEEE SIGHT Tunisia group and its student leaders from Region 8.

IEEE ACTIVITIES


IEEE Activities
Boards/Committees:
• IEEE-USA Board of Directors, 2021-2022
• IEEE Industry Engagement Committee, 2021-Present
• IEEE-USA CHIPS Industry Roundtable
• IEEE Foundation 50th Anniversary Committee
• IEEE-USA MOVE Program Leadership Team, 2021-Present
• IEEE App Working Group, 2021-Present
• IEEE New Initiative Committee, 2021-2022
• IEEE Humanitarian Committee, Projects Chair, 2018
• IEEE SIGHT Chair, 2017
• IEEE Internet Initiative (3I) Adhoc Committee, Internet Inclusion Chair, 2015-2017
TAB:
• IEEE FNTC, Vice-Chair, 2022-Present
• IEEE Future Networks Initiative, Co-Chair, 2017-2022
• TAB Adhoc on Data Product Strategy, 2022-Present
• IEEE Technical Activities Board, 2015

SOCIETIES: (MTT-S, COMSOC, EP-S, AP-S, AESS, SSCS)
• MTT-S 
o President, 2015
o AdCom, 2006-2017
o Chair: IMSEC, Strategic Planning, Budget, SIGHT, Electronics Communications, FDC-5G
o Journal Reviewer, T-MTT, MWTL
o Technical Committees: Millimeter-wave Circuits, Microwave Packaging, Microwave Aerospace Systems
o Walter N. Cox Award, 2006
• EP-S
o Co-Chair: Heterogenous Integration Roadmap (HIR) TWGs for Aerospace & Defense and 5G, 2017-Present
• COMSOC
o Co-Chair: International Network Generations Roadmap (INGR) TWG, 2018-Present
MGA:
• MGA Operations Committee, 2021
• MGA Strategic Planning Committee, 2019
REGION:
• Region 6 Director, 2021-2022
• IEEE Region 6 Industrial Engagement Chair, 2023
• IEEE-USA MOVE West Coordinator, 2022-Present
• R6 Secretary and Electronics Communications, 2018
• IEEE R6 Conference Keynote Speaker: Rising Stars and GHTC

SECTION:
• Los Angeles Coastal LA Section
o MTT-S Chapter Chair, 2003-2005
o Student Activities Chair, 2009-2015

CONFERENCES:
• IEEE MILCOM Technical Program Committee, 2023
• IEEE Future Networks World Forum, 2018-Present
• IEEE 2020 International Microwave Symposium General Chair
• IMS Steering committee and TPC, 2000-Present
• IEEE HIR Symposium, 2017-Present

A Brief Introduction to the US CHIPS & Science Act

Reference:  https://chips.gov

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IEEE Mission: We foster technological innovation and excellence for the Benefit of Humanity.
IEEE Future Networks Technical Community - Innovation for the Connected World

I am an IEEE Brand Ambassador for Region 6, 5G Initiative, Internet Inclusion and Humanitarian Activities
Vote for Tim Lee to be your IEEE-USA President-Elect!
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